Thermal Imaging PCBA

Thermal imaging PCBA (printed circuit board assembly) is the core electronic control unit of thermal imaging equipment, which is mainly responsible for infrared signal processing, image generation and system control. The following is an introduction from the aspects of function, composition, technical characteristics, etc.:

Core function

• Infrared signal processing: Receive the temperature signal collected by the thermal imaging sensor (such as infrared focal plane array), convert it into an electrical signal, amplify and filter it to ensure data accuracy.

• Image algorithm operation: Map temperature data to thermal imaging images (such as pseudo-color rendering) through built-in algorithms, and support temperature calibration, noise reduction and other processing.

• System control and interaction: Respond to button/touch screen commands (such as mode switching, temperature range adjustment), drive the display screen to output thermal imaging pictures, and some models support data storage and transmission.

Main components

• Main control chip/processor: core computing unit, runs thermal imaging algorithms, coordinates the work of sensors, memory and other components (such as Qualcomm Snapdragon, dedicated DSP chips).

• Infrared sensor interface circuit: connects to infrared detectors (such as vanadium oxide, amorphous silicon sensors) to achieve signal acquisition and preprocessing.

• Image signal processing (ISP) module: corrects (non-uniformity correction) and enhances (contrast adjustment) the raw infrared data to generate a visual thermal image.

• Power management circuit: provides multiple stable voltages (such as 3.3V, 5V) to meet the power supply requirements of high-precision components such as sensors and chips, and avoids power supply fluctuations affecting imaging quality.

• Communication and storage interface: supports USB, HDMI, Wi-Fi and other interfaces to transmit data, or integrates storage chips (such as Flash) to save image/temperature data.

Technical features

• High-precision signal chain design: The infrared signal is weak (microvolt level), and the PCBA needs to adopt low-noise amplifiers, shielded wiring and other designs to reduce electromagnetic interference (EMI).

• Temperature stability requirements: Thermal imaging is sensitive to temperature, and the PCBA needs to use a constant temperature circuit or temperature compensation algorithm to reduce the impact of its own heating on the sensor.

• Heat dissipation and structural adaptation: The PCBA of some industrial-grade thermal imaging equipment may integrate heat sinks or thermal conductive materials to prevent chip overheating from affecting performance.

• Ability to resist harsh environments: Military/industrial thermal imaging PCBAs are often treated with three anti-paints (moisture-proof, dust-proof, and vibration-proof) to adapt to complex working conditions.

Application scenarios

• Industrial detection: temperature measurement of power equipment (such as cable connector overheating detection), mechanical fault diagnosis (bearing temperature monitoring).

• Security monitoring: night vision monitoring, fire warning (identifying the source of fire through temperature anomalies).

• Medical field: body surface temperature screening (such as infrared thermometers during the epidemic), traditional Chinese medicine thermal imaging diagnosis.

• Consumer electronics: mobile phone thermal imaging accessories, smart home temperature monitoring equipment.

Differences from other PCBAs

Compared with ordinary home appliance PCBAs, thermal imaging PCBAs focus more on weak signal processing accuracy and temperature algorithm complexity. Its core technical barriers lie in the correction algorithm of infrared images and hardware anti-interference design, which directly affect key indicators such as thermal imaging resolution and temperature measurement error (usually ±2℃ or ±2%).